Used DISCO DFG8830 for sale

The DISCO DFG8830 is a fully automated, dual-spindle wafer grinding machine designed for high-volume backside thinning of 300mm wafers. It is part of DISCO’s high-end grinding platform, developed for advanced packaging and wafer manufacturing.

Core Capabilities

Equipped with dual grinding spindles, the system enables continuous coarse and fine grinding in a single process. This eliminates the need to transfer wafers between different machines, significantly increasing throughput while reducing the risk of breakage for ultra-thin wafers. Integrated in-line thickness measurement ensures excellent Total Thickness Variation (TTV) and superior surface quality, meeting the stringent ultra-thinning requirements for applications such as HBM (High Bandwidth Memory) and advanced logic chips.

Automation and Process

The system comes standard with FOUP handling and fully automated loading/unloading, an integrated cleaning unit, and support for SECS/GEM communication, allowing for seamless integration into 300mm automated production lines. It is compatible with a wide range of materials—including silicon, compound semiconductors (SiC, GaN), and hard, brittle materials—and offers an optional TAIKO thinning process to address edge-stress issues.

Positioning Summary

With its efficient dual-spindle grinding and high level of automation stability, the DFG8830 serves as a core tool for 300mm production lines, delivering high throughput and low breakage rates during backside thinning. It is ideally suited for mass-production environments that demand high capacity and high yield.