Used DISCO DGP8762 for sale

The DISCO DGP8762 is a fully automated, integrated grinding and polishing system. As an upgraded successor to the DGP8761, it is specifically designed for high-end, high-volume production of 300mm wafers.

Core Concept: Integrated Grinding and Polishing

The system combines dual-spindle grinding and dry polishing within a single unit, enabling a continuous process—from coarse grinding and fine grinding to polishing—without the need to transfer wafers between different machines. This significantly reduces the risk of wafer breakage during the handling of ultra-thin wafers.

Key Upgrades and Features

Enhanced Precision and Throughput: Optimized spindle feed control and in-line thickness measurement deliver superior TTV (Total Thickness Variation) performance and surface quality, meeting the extreme thinning requirements for technologies such as HBM and 3D NAND.

Full Automation: Equipped with standard FOUP handling and automated loading/unloading, an integrated cleaning unit, and support for SECS/GEM communication, the system integrates seamlessly into 300mm high-volume production lines.

Ultra-Thin Wafer Handling: The handling mechanism is optimized for ultra-thin wafers (below 50μm) and supports the TAIKO thinning process (optional).

Summary

With its high level of integration and exceptional stability, the DGP8762 serves as a critical production tool for 300mm advanced packaging and wafer manufacturing lines, helping to increase yields and minimize wafer breakage.