Used G&N Wafer Grinder MPS R400 CV

The G&N MPS R400 CV is a German-engineered semiconductor wafer grinding/thinning machine designed for precision thinning and surface grinding, primarily intended for scientific research and small-batch production environments.

Key Features

Processing Method: Utilizes a vertical feed (Z-axis plunge) approach, employing diamond or CBN grinding wheels to thin a rotating wafer at high speeds.

Spindle Design: Features a single-spindle configuration capable of mounting both rough and fine grinding wheels, with automatic switching between them to eliminate the need for manual tool changes.

Compatibility: Supports wafer sizes of 2, 3, 4, 5, 6, and 8 inches, and can process a variety of semiconductor materials, including Si, SiC, GaN, and GaAs.

Precision Specifications: Offers a stage flatness deviation of ≤2μm, a Total Thickness Variation (TTV) of ≤3μm, and a feed precision of ≤1μm.

Positioning Summary

Essentially a high-precision, single-spindle thinning system, the R400 CV balances multi-size compatibility with high grinding accuracy, making it well-suited for research and small-scale production lines. Unlike the "TWIN" series models, the R400 CV is defined by its single-spindle design—which integrates both rough and fine grinding capabilities—rather than a dual-spindle parallel architecture.