Used K&S MAXUM Plus

The K&S MAXUM Plus is a high-speed, fully automatic gold-wire ball bonder, representing an upgraded version within K&S’s classic Maxµm series. While maintaining the stability of the original platform, it offers significant enhancements in ultra-fine-pitch process capabilities and overall throughput.

Key Performance Improvements

Compared to its predecessor, the MAXUM Plus delivers a 10% increase in UPH (units per hour) for most applications, with a wire-bonding cycle time reduced to 63 milliseconds (for standard wire loops). In terms of precision, it achieves a placement accuracy of ±2.5 µm @ 3σ and supports processes with pad pitches as fine as 35 µm.

Critical Technical Advancements

The core of these improvements lies in the "Moving EFO (Electronic Flame-Off) Wand" technology. By positioning the EFO discharge point directly beneath the wire spool—complemented by a specialized, fine-tipped EFO wand and an 8x magnification optical system—the design significantly improves ball formation and concentricity. This reduces the occurrence of "small ball" defects while enhancing intermetallic compound (IMC) coverage and bond strength. Furthermore, a low-friction wire-feed path accommodates wire diameters as small as 15 µm, further expanding the process window.

Applications

This model is primarily designed for semiconductor packaging production lines that demand high precision and high throughput. It is suitable for internal wire bonding in devices such as LEDs, small-to-medium-power transistors, and integrated circuits. As an older, classic model, it remains available on the secondary equipment market; when evaluating such units, particular attention should be paid to the wear condition of the bond head and the software version installed.