Besi Esec 2100 xPplus High-Speed ​​Epoxy Die Bonder

The Besi Esec 2100 xPplus is a high-speed epoxy die bonder from Besi’s 2100 series. It is primarily designed for high-volume production using 300mm-long lead frames and a wide variety of package types. It achieves an optimal balance between speed and precision through its revolutionary "Phi-Y" pick-and-place mechanism—an innovation that earned the platform a Swiss Technology Award upon its release.

Core Performance: The Phi-Y Pick-and-Place Mechanism

The system’s standout technical feature is the Phi-Y pick-and-place mechanism, which integrates rotational and linear motion, replacing the traditional three-stage angular displacement path. Combined with a rigid, symmetrical bonding head and vibration compensation, this system reduces the pick-and-place cycle time to 167 ms. It offers a standard placement accuracy of 20 µm @ 3σ, with an optional high-precision mode that improves accuracy to 15 µm @ 3σ.

Process Compatibility and Specifications

The equipment supports wafers ranging from 4 to 12 inches and accommodates die sizes from 0.25 mm (requiring a small-die kit) up to 20 mm. It handles lead frames with lengths between 90 and 300 mm and widths between 9 and 84 mm. It is suitable for epoxy-based die bonding across a diverse range of package types, including QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.

Summary

The Besi Esec 2100 xPplus is an epoxy die bonder centered on the high-speed Phi-Y pick-and-place mechanism. It combines 15 µm-class precision with broad package compatibility, emphasizing high throughput and ease of product changeover for 300mm-substrate production environments. Most units of this model currently found on the market are pre-owned (second-hand) equipment.