HANMI TC die bonder 4.5 GRIFFIN for sale

The HANMI TC Bonder 4.5 "GRIFFIN" is a thermal compression (TC) bonder developed by HANMI Semiconductor specifically for the mass production of HBM4 (sixth-generation High Bandwidth Memory). Its primary function is to stack DRAM chips layer by layer using a thermal compression process, making it a critical piece of equipment in AI semiconductor packaging production lines.

Positioning and Generational Context

This model is an upgraded version of the TC Bonder 4.0—released by HANMI in May 2025—and has been optimized to meet the specific requirements of SK Hynix. Within HANMI’s product portfolio, the "GRIFFIN" designation continues the company’s tradition of labeling its high-end "Hyper" series, positioning it above other contemporary models such as the "TIGER."

Summary

As a high-end thermal compression bonder optimized for HBM4 stacking processes, the GRIFFIN—backed by mass-production orders from SK Hynix—has become one of the primary systems delivered by HANMI in the competitive race for HBM4 manufacturing equipment.