Used HANM FC BONDER 5.0

The HANMI FC Bonder 5.0 is a fifth-generation flip-chip bonder launched by HANMI Semiconductor in August 2020. As a specialized type of die-bonding equipment, its primary function is to attach flip chips to printed circuit boards (PCBs) using a solder-bump process.

Key Upgrades: Eight-Head Parallel Processing and Intelligent Features

The most significant improvement in this model is the integration of eight multi-die bonding heads—a substantial upgrade from the four-head configuration of its predecessor—which greatly enhances production efficiency. Furthermore, the machine incorporates "smart machine" capabilities, further refining placement accuracy and operational ease.

Process Positioning and Target Market

By utilizing a solder-bump bonding method, the FC Bonder enables finer circuit interconnections compared to traditional gold, silver, or copper wire bonding. It is primarily designed for the packaging of high-performance semiconductors and components used in compact IT devices, such as smartphones, smartwatches, and wireless earbuds. With this model, HANMI aims to capture orders from global high-end packaging clients—a market segment long dominated by European manufacturers—by offering a superior balance of performance and cost-effectiveness.

Summary

As a fifth-generation flip-chip bonder, this machine is designed for general-purpose, high-performance semiconductor packaging. Its eight-head parallel architecture boosts mass-production efficiency, making it a pivotal, core model within HANMI’s FC Bonder product line.