Mycronic MRSI-HVM Optoelectronics Manufacturing Flip Chip bonder

The MRSI-HVM, part of the MRSI brand under Mycronic, is a high-precision flip-chip die bonder platform designed for high-volume optoelectronic manufacturing. It is engineered to deliver true high-mix, multi-process flexible mass production with a placement accuracy of 1.5 microns.

Core Performance

The platform features a dual-head, dual-stage architecture and integrates a patented "on-the-fly" nozzle-changing system. Each placement head can carry 12 vacuum nozzles, enabling zero-time tool changes without the need for recalibration. It achieves a throughput of over 1,800 units per hour (UPH) while maintaining a placement accuracy of ±1.5 μm @ 3σ—offering a superior combination of speed and precision within its class.

Process Capabilities

Designed specifically for CoC (Chip-on-Carrier), CoS (Chip-on-Submount), and CoB (Chip-on-Board) packaging, the HVM supports both eutectic bonding and epoxy dispensing/dipping processes. An optional heated head on the right side supports either constant-temperature or pulsed heating, allowing for multi-chip eutectic bonding without reflowing adjacent solder joints. A conveyor-based version further enables automated, in-line production for AOC (Active Optical Cable), PCB, and Gold-box packaging.

Market Position

The platform has received a *Laser Focus World* Innovation Award and is widely regarded in the industry as a benchmark system for high-precision optoelectronic mass production. Several specialized models within the MRSI-H series—such as the H-LD, H-HPLD, and H-TO—are derived from the core technical modules of the HVM platform.