Used HANMI BOC COB Bonder for sale

The HANMI BOC COB Bonder, launched by HANMI Semiconductor in February 2026, is the world’s first "two-in-one" memory bonding system. Its core innovation lies in integrating two processes—BOC (Board On Chip) and COB (Chip On Board)—onto a single platform, whereas previously, each process required its own dedicated piece of equipment.

Core Value Proposition: Process Integration

In traditional production lines, the BOC process (utilizing flip-chip technology, primarily for DRAM) and the COB process (utilizing non-flip-chip technology, primarily for high-capacity NAND flash) require separate bonding machines. By consolidating these capabilities, the system allows customers to switch between GDDR and eSSD product lines without needing to change equipment. This significantly enhances production line flexibility, improves space utilization, and reduces capital expenditure (CAPEX).

Technical Foundation and Target Market

The system leverages HANMI’s industry-leading design expertise in TC (Thermal Compression) bonders, with a particular focus on advanced thermal management. It incorporates precision temperature control systems into both the stage and the bonding head, ensuring thermal stability across various process conditions—a critical factor for maintaining high yields. The system is specifically targeted at high-performance memory solutions essential for AI semiconductors, including stacked GDDR and enterprise-grade eSSD.