Used HANMI TC die BONDER 1.0 GRIFFIN

The HANMI TC Bonder 1.0 "GRIFFIN" is a third-generation thermal compression bonding (TCB) system developed by HANMI Semiconductor for HBM (High Bandwidth Memory) production. Its primary function is to stack DRAM chips layer-by-layer using thermal compression, making it a critical piece of equipment in AI semiconductor packaging production lines.

Core Positioning and Process

As part of HANMI’s "DUAL TC BONDER" series, the "GRIFFIN" model is specifically designed for the chip-stacking requirements of next-generation HBM. It employs a thermal compression bonding (TCB) process to attach processed wafers and chips, enabling the multi-layer vertical stacking of DRAM.

Market Position and Clientele

HANMI holds the largest global market share for TC bonders used in HBM production. The GRIFFIN system has secured volume orders from SK Hynix, with multiple supply contracts signed between 2023 and 2024. Furthermore, HANMI has indicated that its TC bonders are utilized in the production of NVIDIA’s next-generation AI chips, the "Blackwell" series.

Further Evolution

Building upon the GRIFFIN platform, HANMI subsequently introduced the "GRIFFIN SB" (Super Bonding Head) version. By incorporating an upgraded core bonding head, this iteration offers enhanced productivity and precision in chip stacking; it is primarily used for the mass production of 8-layer and 12-layer HBM3E products.