G&N MPS 2 R300 CV 6-inch Precision Wafer Grinding and Thinning System

The G&N MPS 2 R300 CV is a 6-inch precision wafer grinding/thinning system from the German company G&N. Designed for scientific research and small-batch production, it features a highly flexible configuration centered on a single spindle equipped with dual grinding wheels.

Core Architecture and Process

The system utilizes a vertical-feed grinding method. A single spindle can accommodate both coarse and fine grinding wheels, with automatic switching capabilities that minimize downtime for tool changes. It is compatible with wafers ranging from 2 to 6 inches and can process a variety of semiconductor materials, including Si, SiC, GaN, GaAs, and InP.

Precision and Stability

Grinding wheel feed is controlled by a high-precision servo motor, complemented by a high-accuracy balancing system that compensates for vibrations during the thinning process, ensuring excellent repeatability. The system is specified to maintain a low Total Thickness Variation (TTV), with a surface flatness deviation of ≤3μm on the sample stage.

Operation and Expandability

The system features an intuitive, interactive PC-based touchscreen interface and supports the automated execution of multiple process recipes. Optional features include a film-thickness measurement module and a variety of vacuum chucks for different wafer sizes. The fully enclosed grinding zone ensures a clean processing environment.

Summary

The primary advantage of this model lies in its ability to handle thinning requirements for various wafer sizes and materials within a single unit, offering an optimal balance of precision and process flexibility for research and small-scale production environments.