G&N MPS2-R300-CV 6-inch Semiconductor Wafer Grinding/Thinning System

The G&N MPS2-R300-CV is a 6-inch semiconductor wafer grinding/thinning system developed by the German company G&N. It is primarily designed for research and development (R&D) applications and small-batch production, offering both multi-size compatibility and high-precision grinding capabilities.

Core Architecture and Process

The system utilizes a vertical-feed (Z-axis) grinding method, employing diamond or CBN grinding wheels to thin rotating wafers at high speeds. Its single-spindle design accommodates both coarse and fine grinding wheels, allowing for automatic switching and eliminating the need for manual tool changes during the process. It supports wafers ranging from 2 to 6 inches in diameter and can process a variety of semiconductor materials, including Si, SiC, GaN, GaAs, and InP.

Precision and Control

The feed of the grinding wheel is controlled by a high-precision servo motor, complemented by a balancing system that compensates for vibrations during the thinning process to ensure consistent, repeatable results. The sample stage maintains a surface flatness deviation of ≤3μm, aimed at achieving minimal Total Thickness Variation (TTV). The system is managed by a high-precision PLC that supports the automated execution of multiple pre-programmed recipes, and it features an intuitive, interactive touchscreen human-machine interface (HMI) for ease of operation.

Summary

As a wafer-thinning system, the G&N MPS2-R300-CV’s key strengths lie in its integrated single-spindle design—capable of both coarse and fine grinding—and its compatibility with various wafer sizes, offering an ideal balance of precision and process flexibility for R&D environments and small-scale production lines.