Mycronic MRSI-H-HPLD High-Precision Flip Chip Die Bonder

The Mycronic MRSI-H-HPLD is a high-precision flip-chip die bonder from the MRSI-H series, specifically engineered for the high-volume assembly of high-power laser diodes (HPLD). It is designed to offer exceptional flexibility for the mass production of various packaging formats—such as CoS (Chip-on-Submount), C-mount, and Bar-on-Submount (BoS)—while maintaining a placement accuracy of 1.5 μm.

Core Process Capabilities

A standout feature of this system is its multi-package compatibility; it can perform eutectic bonding for both single-emitter laser diodes and laser bars onto various carriers within a single platform, eliminating the need for equipment changes. To address the critical challenge of coplanarity in HPLD packaging, MRSI provides custom-designed, self-balancing tools. These tools apply uniform pressure to mitigate the "smile" effect during laser bar placement—limiting the "smile" to under 2 μm—thereby meeting the stringent beam-quality requirements for AuSn eutectic bonding.

Precision and Reliability

Process validation using glass dies demonstrates that the system achieves placement repeatability (at 3σ) of better than 1 μm in the X-axis and 0.5 μm in the Y-axis, with an overhang (OH) for CoS assembly controlled to within 4 μm. The voiding ratio at the solder interface surpasses the MIL-STD 883K standard and meets even stricter, HPLD-specific voiding specifications—a crucial factor for the heat dissipation and long-term reliability of high-power lasers.

Market Recognition and Evolution

The MRSI-H-HPLD was honored with a Silver Award at the 2022 *Laser Focus World* Innovation Awards. Its successor, the HPLD+, incorporates robotic-assisted loading and parallel processing capabilities, boosting the operational efficiency of the single-head system by over 30%. This further strengthens its competitive edge in high-volume production scenarios, such as 5G optical communications and automotive LiDAR.