Used Canon Die Bonder BESTEM-D311Plus

The BESTEM-D311Plus is a die bonder from Canon’s BESTEM series, designed for high-volume die-attach applications in advanced packaging production lines. As a die bonder, its primary function is the high-precision placement of bare dies onto substrates or wafers; it is not used for testing or thin-film deposition.

Process Application: It is utilized for flip-chip bonding, die stacking in 2.5D/3D packaging, and die placement in fan-out packaging. Its core purpose is to ensure high-precision alignment and stable bonding between the die and the substrate, falling under the category of back-end packaging processes.

Design Focus: The system emphasizes high-precision visual alignment and bonding stability. It is equipped with advanced motion control and vision systems, supports flexible switching between various packaging recipes, and balances high-volume throughput with high bonding yield. The "Plus" suffix indicates an enhanced configuration compared to the base D311 model, typically offering improvements in alignment accuracy, throughput, or process versatility.

Classification: As a die-bonding tool, it belongs to the back-end packaging segment—a distinct process stage from thin-film deposition or electroplating. Within the BESTEM product family, the D311Plus occupies a specific position—distinct from models like the D510 or D610—while collectively addressing the precision requirements for die placement in advanced packaging.