Used KAIJO DBX-1000 die bonder for sale

The KAIJO DBX-1000 is a fully automatic die bonder—not a wire bonder. Designed primarily for the LED and discrete component markets, it is used to precisely attach semiconductor dies onto lead frames or substrates using epoxy resin.

Core Positioning and Process

The system utilizes an epoxy-dispensing die-bonding process (dispensing followed by placement) rather than thermosonic bonding. It employs a unique 90-degree pick-and-place mechanism. Developed by KAIJO specifically for high-volume LED production, the machine is engineered for high speed and excellent cost-effectiveness.

Key Specifications and Performance

Speed and Throughput: The cycle time is approximately 0.18 seconds per die (excluding auxiliary time), with a theoretical throughput of about 14,000 units per hour.

Accuracy: Positional accuracy is ±25 μm (3σ), and angular accuracy is ±3° (3σ).

Compatibility: It supports die sizes ranging from 0.15 mm to 1.5 mm square and accommodates lead frames or substrates with widths of 20–100 mm and lengths of 90–230 mm.

Wafer Support: Capable of handling 4-inch or 6-inch wafer rings.

Key Features

The system is equipped with dual bonding stages; by operating alternately, it minimizes downtime during substrate replacement, thereby enhancing production efficiency. It utilizes a Voice Coil Motor (VCM) to control the bonding arm, ensuring precise positioning and bonding force. Additionally, it features a micro-flow sensor to detect errors during the pick-up or placement process, helping to maintain high yield rates.