Used MRSI-505 die bonder for sale

The MRSI-505 is a high-precision die-bonding and microelectronics assembly platform, once regarded as the industry-standard equipment for the manufacturing of microwave, RF, and optical modules.

Key features include a granite top platform that ensures mechanical and thermal stability, as well as support for various eutectic bonding processes—such as AuSi, AuSn, and AuGe. The system offers flip-chip capabilities; utilizing an upward-looking camera and precisely controlled contact force, it can delicately handle fragile dies, including those made of GaAs. Furthermore, the equipment supports 360° random die orientation recognition and is SMEMA-compliant, enabling seamless integration into in-line production workflows.