TERADYNE Titan System-Level Test (SLT) Platform

The Teradyne Titan is not a conventional wafer or package tester; rather, it is a System-Level Test (SLT) platform designed to serve as a "third line of defense"—following wafer and package testing—for complex SoCs, such as mobile application processors.

Core Positioning and Value

As chip complexity increases, even an ATE (Automated Test Equipment) setup with 99.5% fault coverage still leaves a significant number of transistors untested. By simulating end-user environments and running actual software workloads, the Titan verifies interactions between IP blocks as well as hardware-software synergy, effectively capturing latent defects that are difficult for ATE to detect. Its asynchronous socket architecture offers up to 30% higher throughput compared to traditional batch-processing systems, helping to lower the per-unit test cost.

Key Specifications and Capabilities

High Density and High Parallelism: A single system supports up to 424 test sites within a compact footprint, making it well-suited for high-volume production environments.

High-Speed Interfaces: Test fixtures utilize ATE-grade interconnects, supporting data rates of up to 20 Gbps and a mating lifespan exceeding 100,000 cycles.

Asynchronous Architecture: Each test site operates independently; maintenance or long-duration testing at an individual site does not cause system downtime.

Package Compatibility: Supports a wide range of package types, including PoP, BGA, PGA, and LGA.

Target Applications

The Titan has been proven in high-volume production for mobile application processors for years and has since expanded into sectors with rigorous system-level performance requirements, such as automotive ADAS, infotainment systems, and AI data centers. For high-power AI and cloud infrastructure chips, Teradyne also offers the Titan HP model, which supports kilowatt-level power delivery per chip and features more precise active thermal control.