HANMI 1.0 TIGER HBM Hot Press Bonding Die Bonder

The HANMI TC Bonder 1.0 TIGER is a thermal compression (TC) bonder designed specifically for HBM (High Bandwidth Memory) production, launched by HANMI Semiconductor in April 2024. Its primary function is to stack semiconductor chips onto a wafer using TSV (Through-Silicon Via) technology. It serves as an "extra" (supplementary) model within the company’s TC Bonder product line.

Product Positioning and Series Context

Within HANMI’s portfolio of TC bonders for HBM, the TIGER is positioned as an "extra" model. It complements the existing "Hyper" model (GRIFFIN) and "Premium" model (DRAGON)—which cater to different customer requirements and technical specifications—by broadening the product selection and reaching a wider customer base. HANMI anticipates that this model will contribute to sales growth for the year.

Core Functionality

The equipment performs the essential die-bonding process: stacking chips—manufactured using TSV (Through-Silicon Via) technology—layer by layer and bonding them onto a wafer. It leverages the bonding expertise HANMI has cultivated in the HBM TC Bonder sector—a market in which the company holds the largest global share.