Canon BESTEM D310 for sale

The BESTEM D310 is a die bonder from Canon’s BESTEM series, designed for high-volume die-attach applications in advanced packaging production lines. As a die-bonding machine, its primary function is the high-precision placement of bare dies onto substrates or wafers; it is not used for testing or thin-film deposition.

Process Application: The system is utilized for flip-chip bonding, die stacking in 2.5D/3D packaging, and die placement in fan-out packaging. It addresses the critical requirements for high-precision alignment and stable bonding between the die and the substrate, operating within the back-end packaging process. Within the BESTEM series, the D310 serves as a foundational high-volume production model and the technical basis for derivatives such as the D311Plus. Together with models like the D320 and D340, it addresses a range of requirements for precision and throughput.

Design Focus: The D310 emphasizes high-precision visual alignment and bonding stability. It is equipped with sophisticated motion control and vision systems, supports flexible switching between various packaging recipes, and balances high-volume throughput with assembly yield. As a foundational model, the D310 prioritizes a balance between production cycle time (takt time) and cost, making it well-suited for high-volume production scenarios that require high—though not necessarily extreme—levels of placement precision.

Classification: Categorized as a die-bonding tool within the packaging equipment segment, the D310 operates in the back-end packaging stage—a distinct process phase from thin-film deposition or electroplating. In short, the D310 is a core die-bonding machine within Canon’s BESTEM family, designed for high-volume packaging production.