HANMI 2.5D TC BONDER 40 C2W TCB die bonder

The HANMI 2.5D TC Bonder 40 C2W is a thermal compression (TC) bonding system designed specifically for high-performance 2.5D semiconductor packaging. Its primary function is the high-precision bonding of individual chips onto a wafer.

Core Positioning

Developed by HANMI Semiconductor, this system is part of a product line tailored for 2.5D packaging of AI system semiconductors. The "C2W" designation stands for "Chip-to-Wafer"—a process involving the bonding of singulated chips onto a full wafer—which distinguishes it from "C2S" (Chip-to-Substrate) processes.

Key Capabilities

According to official product specifications, the system is engineered for the precision bonding of chips, supporting dimensions up to 40mm × 40mm. It is designed for 2.5D advanced packaging applications essential for AI hardware, such as integrating various components—including GPUs, CPUs, or HBM (High Bandwidth Memory)—onto a single package via a silicon interposer. Deliveries of this model to global foundry and OSAT (Outsourced Semiconductor Assembly and Test) customers for mass production began in late 2025.

Summary

This is a high-precision 2.5D packaging tool that utilizes thermal compression to bond chips onto wafers, specifically targeting the "Chip-to-Wafer" process stage for AI system semiconductors.