MycronMRSI-H-LD 1.5-micron high-precision flip-chip die bonder

The Mycronic MRSI-H-LD is a 1.5-micron high-precision flip-chip bonder designed for the high-volume manufacturing of advanced photonics and RF/microwave devices, offering an optimal balance between high speed and high flexibility.

Core Positioning and Process Capabilities

This system is widely used in the packaging of optoelectronic devices—such as lasers, transceivers, and sensors—supporting various configurations including CoC (Chip-on-Carrier), CoS (Chip-on-Submount), CoB (Chip-on-Board), and gold-box packaging. It integrates eutectic bonding, epoxy dispensing, and UV-curing processes into a single platform. Built upon the field-proven MRSI-HVM architecture, it offers an optional heated bonding head to accommodate high-density eutectic packaging requirements.

Key Efficiency and Precision Features

A standout feature of the system is its patented "on-the-fly" automatic nozzle-changing mechanism. The bonding head is equipped with up to 12 vacuum nozzles, enabling zero-time tool switching and significantly reducing downtime during mixed-product or multi-process production runs. In terms of precision, experimental data indicates a placement repeatability (X/Y axes) of better than 1μm@3σ and 0.5μm@3σ, respectively. For CoS assembly, the protrusion (squeeze-out) can be controlled to within 4μm, while solder voiding levels consistently outperform the requirements set by the MIL-STD 883K standard.