Mycronic MRSI-M3 3-micron precision die bonder

The MRSI-M3, a high-volume 3-micron precision chip mounter from Mycronic, sets an industry benchmark in ultra-high precision and complex packaging scenarios. Its core value lies in combining 3-micron mounting precision with large-scale automated production capabilities, making it suitable for microwave modules, infrared sensors, MEMS, multi-chip modules, and optoelectronic packaging.

Core Process and Hardware Features: The equipment utilizes a cast polymer substrate and a brushless DC linear servo motor drive, coupled with linear encoder feedback, achieving sub-micron resolution while ensuring high-speed movement. Closed-loop pressure control allows for placement force as low as 10 grams to handle fragile GaAs chips, and can be programmably increased to 2 kg. Feeding is compatible with various formats including waffle trays, Gel-Pak®, wafers, and strips.

Efficiency and Process Integration: The MRSI-M3 features a patented turret integrating up to 12 nozzles, enabling seamless tool changes and significantly reducing downtime in multi-process mixed-line production. The platform supports in-situ eutectic bonding, epoxy dispensing/dip bonding, and flip chip mounting, and can be optionally equipped with UV curing and scraping functions to form a complete assembly solution.