Used Mycronic MRSI-HVM1 for sale

The MRSI-HVM1, launched by Mycronic in the fourth quarter of 2022, is a 1-micron-class flip-chip bonder. Positioned as a high-precision evolution of the MRSI-HVM platform, it is specifically designed for high-volume manufacturing scenarios—such as silicon photonics and LiDAR—that demand exceptionally stringent placement accuracy.

A Leap in Precision and Strategic Market Entry

The core advancement of the HVM1 lies in its improved placement accuracy, which has been refined from the 1.5-micron capability of the standard HVM platform to 1 micron. This enhancement enables the machine to meet the rigorous alignment thresholds required for high-density packaging in silicon photonic chips and LiDAR components. This upgrade is more than a routine iteration; it represents a proactive strategic move to capture emerging, high-growth markets, including the mass production of silicon photonics and automotive LiDAR.

Inherited Production Architecture

The system retains the dual-head, dual-eutectic-stage architecture of the HVM platform. It supports CoC (Chip-on-Carrier), CoS (Chip-on-Substrate), and CoB (Chip-on-Board) packaging, with process capabilities covering eutectic bonding, epoxy dipping, UV dispensing, and in-situ curing. A conveyor-based version facilitates automated material flow for AOC (Active Optical Cable) assemblies, "Gold-box" packages, and PCB carriers. Meanwhile, the heated-head variant preserves localized pulse-heating functionality on the right-hand side, preventing the reflow of adjacent solder joints during multi-chip eutectic bonding.

Distinct Positioning

Unlike other models in the HVM series—which emphasize features like "zero-time" nozzle changes and extreme throughput—the HVM1 has a more focused objective: it centers its value proposition on superior precision, catering to high-end optoelectronic packaging lines that demand both ultra-low placement error tolerance and high-volume production speeds.