Mycronic MRSI-S-HVM Sub-micron Dual-precision Mode Flip chip Bonder

The MRSI-S-HVM is the first sub-micron flip-chip bonder from Mycronic to feature a dual-precision mode. It is specifically designed for the high-volume manufacturing of silicon photonics, wafer-level packaging, and heterogeneous integration of chiplets.

Core Breakthrough: Automatic Dual-Precision Switching

The system supports automatic, programmable switching between two precision modes—±0.5 μm @ 3σ and ±1.5 μm @ 3σ—allowing users to flexibly allocate precision levels based on the specific requirements of each chip within a single machine, thereby balancing yield and throughput. The 0.5 μm mode utilizes real-time alignment and coaxial Z-axis force control to ensure optimal coplanarity.

Process Capabilities and Architecture

Building on the HVM platform’s dual-gantry, dual-head architecture and patented automatic nozzle-changing system, the MRSI-S-HVM supports a wide range of processes, including eutectic bonding, epoxy dispensing/dipping, DAF (Die Attach Film) application, and laser-assisted bottom-side bonding. During flip-chip assembly, the system performs direct alignment between the chip and the substrate’s reference points, eliminating the need for additional calibration marks during the wafer fabrication stage.

Market Recognition

Launched in 2020, the MRSI-S-HVM has received the "Most Competitive Product" award from ICC (Information & Communication Center) and an Innovation Award from *Laser Focus World*. It has already secured volume orders in both the U.S. and Chinese markets.