Used CANON Lithography Machine MPA-600 SUPFR

The Canon MPA-600 SUPFR is a contact/proximity mask aligner designed for wafers 6 inches (150 mm) in diameter or smaller, belonging to Canon’s classic MPA series platform.

Core Positioning: A Classic Tool for Small-Format Mass Production and R&D

Utilizing either contact or proximity exposure modes, this system is primarily employed for mature and specialized processes on production lines handling wafers of 6 inches or less. It is widely used in the manufacturing of power semiconductors (such as diodes and thyristors), discrete devices, MEMS, and surface acoustic wave (SAW) devices. For production lines and R&D environments involving smaller wafers that do not require ultra-high resolution (typically operating at the micron scale), it serves as a highly cost-effective solution.

Key Technical Features

High-Power, High-Throughput Exposure: The system typically employs a high-power mercury lamp, providing intense and uniform ultraviolet (UV) light. This ensures efficient, consistent exposure across entire batches of wafers or panels, resulting in high throughput.

Uniform Contact/Proximity Exposure: Featuring a large exposure field, the system operates by either bringing the wafer into direct contact with the photomask or maintaining a precise, minute gap (proximity mode). It incorporates sophisticated gap-control and leveling systems to ensure pattern uniformity and a low defect rate over large exposure areas.

Mature Automation and Operation: Equipped with a standard wafer-handling system, it supports cassette-to-cassette batch processing. The user interface is intuitive, and the light source offers a long service life. Furthermore, its relatively simple architecture ensures low costs for both routine maintenance and spare parts.

Summary

With its ability to deliver uniform, large-area exposure, combined with high cost-effectiveness and stable mass-production capabilities, the Canon MPA-600 SUPFR stands as an essential, classic lithography tool for production lines focused on power devices and specialized processes using wafers of 6 inches or smaller.