Used TOWA CPM1080-HP molding machine for sale

The TOWA CPM1080-HP is a high-precision model within the CPM1080 compression molding platform from the Japanese company TOWA. It is specifically designed for advanced packaging—including WLP (Wafer-Level Packaging) and PLP (Panel-Level Packaging)—and is primarily targeted at cutting-edge processes such as HBM, 2.5D/3D integration, and Chiplet-based architectures, which demand exceptionally high levels of precision.

Core Positioning and Process Capabilities

Unlike other fully automated, high-volume production models in the CPM1080 series, the HP (High-Precision) version emphasizes a combination of superior precision and high productivity. It utilizes TOWA’s proprietary compression molding technology, which minimizes resin flow, effectively reducing die shift and void formation—making it ideal for advanced packaging applications that require stringent reliability and high yields.

Key Technical Features

The system features a unique, uniform resin distribution and patterned dispensing mechanism, capable of handling both ultra-thin and ultra-thick products. It also supports the MUF (Molded Underfill) process. In terms of quality control, the equipment offers enhanced mold-thickness uniformity and superior vacuum capabilities, ensuring higher-quality molding results.

Target Applications

The CPM1080-HP is primarily designed for heterogeneous integration packaging—such as HBM, 2.5D/3D ICs, and Chiplets—as well as wafer-level (FOWLP) and panel-level (PLP) packaging processes. For R&D and mass-production environments that involve ultra-thin or ultra-thick packages and require strict control over molding uniformity and filling quality, this high-precision model serves as a highly specialized solution.