YAMAHA GTM-X MS Manual Semiconductor Encapsulation Molding System

The YAMAHA GTM-X MS is a manual semiconductor encapsulation system designed with a core philosophy: "bringing the capabilities of an automated molding machine to a manual system." This ensures that prototyping and small-batch production achieve the same molding quality as full-scale automated production lines.

Core Positioning

Specifically engineered for prototyping, small-batch runs, and high-mix production, this system utilizes thermosetting resins to encapsulate semiconductor packages, general electronic components, and automotive electronics (such as IGBTs and ECUs). Because it employs the same core molding unit found in Apic Yamada’s automated systems, process parameters established during small-batch validation can be seamlessly transferred to subsequent automated mass-production lines.

Key Specifications and Capabilities

In terms of molding capacity, the GTM-X MS supports lead frames up to 100 × 300 mm and can process two frames per mold—an increase in molding area of approximately 60% compared to previous models. It offers a choice of 120-ton or 170-ton clamping force, with injection capacities ranging from 4.9–29.4 kN and 4.9–41.2 kN, respectively. Both the clamping and transfer mechanisms are driven by AC servo motors, ensuring excellent ejector control even at low speeds. This enables high-precision, stable clamping and resin injection, while eliminating the need for hydraulic oil management or cooling water.

Flexibility and Operation

The system offers exceptional process flexibility; by simply changing the mold, users can switch between methods such as transfer molding and compression molding. It features a touchscreen interface for managing product changeovers, recipe registration, and molding parameter adjustments. The system also includes data logging and external export functions, facilitating process traceability. Furthermore, it can be equipped with optional modules—such as the FAME (Flexible Advanced Molding Equipment) mechanism, bottom-mold substrate suction, vacuum units, and degassing units—to accommodate more complex encapsulation requirements.