Used Besi Fico AMS-LM Top Foil

The Besi Fico AMS-LM Top Foil is a fully automated molding system designed for single-sided encapsulation of large-format substrates (such as BGA, QFN, and BOC packages). Its core feature is "Top Foil" technology, which enables bleed-free molding for products with exposed dies.

Core Process: Top Foil Technology

The system guides a specialized film across the surface of the top mold, creating a soft sealing layer between the mold and the product. This film acts as a barrier, preventing the molding compound from coming into contact with the die surface and ensuring the chip area remains clean. This design eliminates the need for post-molding cleaning processes and facilitates bleed-free production for packages with exposed dies.

Key Specifications

Substrate Compatibility: Supports lead frames/substrates up to 102 × 280 mm with a thickness of 0.1–1.5 mm, covering all current single-sided package types.

Clamping Force: 600 kN (standard) or 750 kN (optional), with a maximum mold opening distance of 90 mm.

Throughput and Reliability: Maximum throughput of approximately 250 strips per hour, with an equipment uptime of ≥ 98%.

Vacuum Capabilities: Supports both substrate-level and mold-cavity vacuum, helping to minimize void formation.

Applications

This system is particularly well-suited for single-sided MAP (Mold Array Process) packages that require exposed dies or bleed-free quality, such as QFN, BGA, BOC, and flip-chip die packages. By preventing the molding compound from contaminating the die pads, the Top Foil solution eliminates the need for post-molding cleaning, thereby improving both yield and production efficiency.