G&N MPS R400 CV TWIN 8-inch Wafer Precision Grinding Machine

The G&N MPS R400 CV TWIN is a dual-wheel grinding system developed by the German company G&N for the precision thinning of wafers up to 8 inches in diameter. Its core design integrates both rough and fine grinding wheels onto a single spindle, enabling a complete, continuous processing workflow without the need for tool changes.

Core Architecture

The system utilizes a single-spindle, dual-wheel configuration. Both rough and fine grinding wheels are mounted on the same spindle and can be switched automatically, eliminating the downtime associated with tool changes found in traditional dual-spindle machines. The grinding process employs a vertical feed (Z-axis plunge) method, where the wafer and the spindle rotate synchronously, and high-speed thinning is performed using diamond or CBN grinding wheels.

Precision and Compatibility

The system is compatible with wafers ranging from 2 to 8 inches and can process a variety of materials, including Si, SiC, GaN, GaAs, and InP. It achieves a surface flatness deviation of ≤2 μm on the chuck, a Total Thickness Variation (TTV) of ≤3 μm per wafer after processing, a feed precision of ≤1 μm, and a minimum step size of 0.1 μm. A high-precision balancing system is incorporated to compensate for grinding vibrations, ensuring consistent results across repeated operations.

Production and Automation

The system features a fully enclosed grinding zone and is managed by a high-precision PLC, supporting the automated execution of multiple processing recipes. It includes an intuitive, interactive touchscreen interface and offers options for integrating film-thickness measurement modules and various vacuum chucks. The equipment is primarily designed for research and development (R&D) environments and small-batch production.