Used SCREEN SS-80EX Spin Scrubber

Short Description:

The SS-80EX is a single-wafer spin scrubber introduced by SCREEN at the end of 2015

Product Detail

SCREEM Wafer Cleaner SS-80EXThe SS-80EX is a single-wafer spin scrubber introduced by SCREEN at the end of 2015. While it follows a similar technical approach to the SP-2100 (a single-wafer spin cleaning system you previously inquired about), the SS-80EX is specifically designed for 100–200mm wafers, with a core value proposition centered on balancing high throughput with minimal downtime.

Throughput and Efficiency: The system achieves a maximum processing capacity of 160 wafers per hour—an increase of approximately 111% over the models SCREEN had available at the time. This gain is primarily driven by a newly designed transport system, rather than simply increasing the rotation speed.

Key Design Distinction: The SS-80EX features a modular, separable chamber design. If a specific chamber requires maintenance—such as the replacement of brushes, pins, or cleaning cups—it can be taken offline individually while the remaining chambers continue to operate. This significantly reduces total system downtime and directly enhances the Overall Equipment Effectiveness (OEE) of high-volume production lines.

Flexible Configuration: The standard setup includes two spin heads, which can be expanded to a maximum of six based on available floor space and production requirements—a capacity that can even be increased after the initial installation. The system offers six proven cleaning configurations; notably, its bevel cleaning capability—achieved through high-precision brush motion control—is highlighted by the manufacturer as a critical feature for improving yield.

In short, the SS-80EX serves as SCREEN’s primary high-volume production tool for single-wafer brush cleaning of 200mm (and smaller) wafers. It complements other systems in the company’s portfolio—such as the SP-2100 (geared toward compound semiconductors) and the CW-2000/FC-3100 (which utilize batch-immersion processing)—thereby establishing a clear process distinction between single-wafer brush cleaning and batch-immersion cleaning.

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