Samco AD-230LP Vertical Batch LPCVD (Low Pressure Chemical Vapor Deposition) System

The AD-230LP is a vertical batch-type LPCVD (Low-Pressure Chemical Vapor Deposition) system from Samco. Designed for high-volume manufacturing, it supports mature process nodes and power device production lines using wafers up to 200mm in diameter.

Process Capabilities: Utilizing the LPCVD method, the system enables the simultaneous processing of multiple wafers in a single reaction tube. It is typically used to deposit materials such as polysilicon, silicon nitride, and silicon dioxide—essential for applications including gate polysilicon, sidewall spacers, hard masks, and passivation layers. Its batch architecture delivers high throughput and low cost-per-wafer, making it well-suited for high-volume production at mature technology nodes.

Design Focus: The AD-230LP prioritizes temperature uniformity and process stability. It features multi-zone temperature control and low-pressure processing capabilities, with a reaction chamber optimized for particle suppression and extended cleaning intervals. The system supports various wafer sizes, allowing for flexible transitions between 100mm, 150mm, and 200mm formats, while its design also emphasizes ease of maintenance for high-volume production environments.

In short, the AD-230LP serves as Samco’s batch-type LPCVD production platform for mature process nodes and power semiconductors. It complements the AL-1 thermal ALD system—which you have previously looked into—by addressing different process requirements: while the AL-1 focuses on the precise deposition of gate oxides for power devices, the AD-230LP is designed for the high-volume deposition of dielectric thin films.