Used TEL TELINDY PLUS™ IRad™

The TEL TELINDY PLUS™ IRad™ is a batch-type thermal ALD/CVD deposition platform from Tokyo Electron (TEL) designed for 300mm wafers. As part of the TELINDY series, it is optimized for advanced dielectric thin films and features, at its core, IRad™ infrared heating technology.

Process Positioning: Operating in a batch mode, the system processes a large number of wafers simultaneously in a single process tube. It supports both thermal ALD and CVD processes, enabling the deposition of highly conformal dielectric films such as silicon oxide and silicon nitride. Typical applications include sidewall spacers, etch-stop layers, hard masks, and conformal liner layers. This batch architecture ensures high throughput while meeting the stringent requirements for film conformality and thickness precision at advanced technology nodes.

Design Focus: The key to IRad™ technology is its use of infrared heating to achieve rapid and uniform wafer heating. By shortening the time required for temperature stabilization, the system boosts throughput and improves thermal uniformity—both across individual wafers and from wafer to wafer. Combined with a low-volume reaction chamber and precise precursor delivery, the platform excels in atomic-level thickness control and coverage of high-aspect-ratio structures, all while minimizing particle defects.

Contextual Distinction: The TELINDY PLUS IRad™ occupies a space between TEL’s traditional batch furnaces and single-wafer ALD systems; it offers greater precision than conventional furnaces and higher throughput than single-wafer tools. It is well-suited for dielectric film applications that demand both high conformality and high productivity. It represents a different capacity paradigm compared to the ASM single-wafer high-k ALD platform you previously inquired about.