Used KAIJO FB-x26

The KAIJO FB-x26 is a high-speed, fully automatic gold/copper wire bonder designed for high-density, fine-pitch packaging. Within KAIJO’s wire bonding platform portfolio, this model is engineered to deliver both high precision and high throughput.

Core Positioning and Efficiency

This system is specifically designed for IC packages that require extremely high pin density and feature tiny bond pads—such as high-pin-count BGAs, CSPs, and MCMs. Its primary strengths lie in rapid response times and precise motion control. Integrated with a high-speed Pattern Recognition System (PRS), the FB-x26 significantly shortens the bonding cycle per wire while maintaining consistent bond quality, thereby boosting overall UPH (units per hour).

Key Process Features

Fine-Pitch Capability: Supports ultra-fine wire diameters and offers superior control over low-loop and reverse-loop profiles, effectively preventing wire crossover or short circuits in high-density packaging.

Precision Ball Formation: Equipped with KAIJO’s proprietary Electronic Flame-Off (EFO) technology, the system ensures the creation of highly spherical and uniform Free Air Balls (FABs)—even with ultra-fine wires—guaranteeing reliable connections at the bond pad.

Closed-Loop Ultrasonic Control: Monitors and adjusts ultrasonic output in real time, allowing the system to adapt to various substrate materials and minimizing bonding defects caused by temperature fluctuations or material variations.

Applications

The FB-x26 is primarily used in production lines for high-density semiconductor chip packaging, serving sectors such as consumer electronics and telecommunications equipment. As a mature, fully automatic wire bonding platform, it is highly effective for advanced packaging applications that demand both high yields and high-volume output.