Used ASM AD210 Plus Fully Automatic Precision Die Bonder

The ASM AD210 Plus is a fully automatic precision die bonder from ASMPT. It is primarily designed for substrate-based assembly applications that require high-precision chip placement, offering compatibility with both 6-inch wafers and relatively large-sized substrates.

Core Specifications and Architecture

The system supports 6-inch wafer input and can handle substrates up to 8×8 inches (approximately 203×203 mm). A key design feature is the independent control of the pick and place processes: the parameters for picking a chip from its carrier can be set separately from those for placing it onto the substrate, eliminating the need to compromise by using a single set of parameters for both operations. A patented bonding head assembly facilitates the transition from picking to placement.

Process Options and Positioning

The machine offers an optional UV rapid-curing system, designed for use with compatible UV-curable adhesives; this allows for the quick fixation of components after placement, facilitating subsequent handling. This feature is specific to adhesive-based curing and is distinct from eutectic heating capabilities. Based on secondary market activity, this model was still being shipped around 2017; most AD210 Plus units currently available on the market are either used or refurbished. As an automated die-bonding platform, its primary practical advantages—substrate size versatility and independent control over pick-and-place operations—make it well-suited for precision chip assembly tasks involving multiple placement locations and medium-sized substrates.