TEL TELINDY PLUS™ for sale

Short Description:

The TEL TELINDY PLUS™ is a batch-type thermal thin-film deposition platform for 300mm wafers

Product Detail

TEL Thin Flim Deposition Equipment TELINDY PLUS™The TEL TELINDY PLUS™ is a batch-type thermal thin-film deposition platform for 300mm wafers. As the foundational model of the TELINDY series, it is designed for the high-volume production of highly conformal dielectric films used in advanced logic and memory chips; it also serves as the technical basis for the IRad version.

Process Positioning: Operating in a batch mode, the TELINDY PLUS can process a large number of wafers simultaneously in a single furnace tube. It supports both thermal ALD and CVD processes, enabling the deposition of highly conformal dielectric films such as silicon oxide and silicon nitride. Typical applications include sidewall spacers, etch-stop layers, hard masks, conformal liner layers, and certain gap-fill processes. Its batch architecture offers superior throughput and lower cost-per-wafer compared to single-wafer systems. Furthermore, through the use of a low-volume reaction chamber and precise precursor delivery, it meets the stringent requirements of advanced technology nodes regarding thickness uniformity and coverage within high-aspect-ratio structures.

Platform Design: The system prioritizes thermal uniformity and process stability, featuring multi-zone temperature control and low-pressure processing capabilities. The reaction chamber is optimized for particle suppression and extended cleaning intervals, making it well-suited for long-term, continuous high-volume production. Designed for 300mm wafers, it complements TEL’s single-wafer ALD platforms—such as EVAROS and EXIM—by handling the batch deposition of highly conformal dielectric films, while single-wafer tools are utilized for more specialized, high-precision processes like the deposition of high-k gate dielectrics.

Version Relationship: The TELINDY PLUS and the IRad version share the same platform architecture. The IRad version incorporates infrared heating to enhance heating efficiency and thermal uniformity, whereas the base version focuses more on versatility and cost-effectiveness.

In short, the TELINDY PLUS is TEL’s primary platform for 300mm batch thermal thin-film deposition, occupying a critical space for high-precision, high-volume manufacturing that bridges the gap between traditional furnace systems and single-wafer ALD tools.

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