Used ASM Eagle 10 Plasma-Enhanced Chemical Vapor Deposition System

The ASM Eagle 10 (note the spelling: "Eagle," not "Eagla") is a single-wafer plasma-enhanced chemical vapor deposition (PECVD) system designed for 150 mm and 200 mm wafers; it is part of ASM’s classic Eagle product platform.

Core Positioning: Dielectric Thin-Film Deposition for Mature Process Nodes

The Eagle 10 served as ASM’s primary PECVD platform during the 200 mm wafer era, catering primarily to mature process nodes and specialty technology production lines. Its standard configuration features two reaction chambers capable of depositing insulating dielectric thin films—such as silicon oxide, silicon nitride, and silicon oxynitride—in high-throughput production environments. These films are widely used in interconnect layers and various other process steps. Furthermore, the platform supports the deposition of the Aurora® series of low-k (low dielectric constant) materials, as well as hard mask layers (NCP) used in deep-ultraviolet (DUV) lithography.

Key Technical Features

Single-Wafer Processing Architecture: Each chamber processes one wafer at a time. Following deposition, an in-situ plasma clean (utilizing gases such as CF₄) can be performed to minimize particle accumulation within the chamber.

Dual-Frequency RF and Parallel-Plate Design: The system employs a combination of 13.56 MHz (high-frequency) and 430 kHz (low-frequency) RF power, integrated with a parallel-plate electrode structure. This configuration enables the deposition of films like silicon nitride at relatively low temperatures (e.g., 300–450°C).

Flexible Chamber Configuration: The base Eagle 10 model is a dual-chamber system; for higher throughput requirements, a three-chamber version—the Eagle 10 Trident—is also available.

Summary: With its dual-chamber, single-wafer architecture and proven PECVD process capabilities, the Eagle 10 stands as a reliable, high-volume production platform for dielectric thin-film deposition on 150 mm and 200 mm lines. It is particularly well-suited for mature process applications that demand consistent film uniformity and strict particle control.