Used ASML Lithography Machine XT 450

The ASML XT:450 is a fully automated step-and-scan lithography system (scanner) designed for 300mm (12-inch) wafers. Part of ASML’s classic XT platform, it utilizes an i-line (365nm) light source.

Core Positioning: A Workhorse for Mature Nodes and Advanced Packaging

This system primarily serves production lines for mature semiconductor nodes (0.35μm and above). With the rapid growth of advanced packaging technologies—such as Flip-Chip, Fan-Out, and 2.5D/3D integration—the XT:450 has become a key piece of equipment for the patterning process in packaging lines, thanks to its exceptional performance with large exposure fields and thick-resist processes.

Key Technical Features

Step-and-Scan Technology and High-Precision Alignment: Utilizing "step-and-scan" technology, the system offers a larger exposure field and superior pattern fidelity compared to traditional "steppers." Its alignment system is optimized for thick-resist processes and wafer warpage, ensuring high-precision overlay accuracy between layers.

High Throughput and Automation: Equipped with a fully automated 300mm wafer handling system (FOUP), the unit delivers high throughput (wafers per hour, or WPH). It supports SECS/GEM communication protocols, allowing for seamless integration into fully automated 300mm mass-production lines.

Mature Platform Ecosystem: The XT platform boasts a massive installed base across the industry, supported by a highly mature process ecosystem. The system combines high stability with low maintenance costs, making it a cost-effective choice for mature-node manufacturing and advanced packaging lines.

Summary

With its stable exposure precision, high throughput, and excellent compatibility with thick-resist processes and warped wafers, the XT:450 serves as an indispensable core lithography tool for 300mm mature-node production and advanced packaging applications.