Used ASML Lithography Machine XT 1400Ei

The ASML XT:1400Ei is a fully automated step-and-scan lithography system (scanner) designed for 300mm (12-inch) wafers. Part of ASML’s classic XT platform, it utilizes an i-line (365nm) light source.

Core Positioning: A Key Lithography Tool for Advanced Packaging

As an i-line-optimized model within the XT series, the XT:1400Ei is specifically engineered for advanced packaging applications—such as Wafer-Level Packaging (WLP), Fan-Out, and Flip-Chip—as well as MEMS manufacturing. The i-line light source offers exceptional penetration depth in thick photoresists, making the system an essential tool for processes involving thick-layer patterning, such as the creation of Redistribution Layers (RDL) and micro-bumps.

Key Technical Features

Large Depth of Focus (DOF) and Compatibility with Thick Resists: Equipped with an optimized i-line optical system, the tool provides a large depth of focus, ensuring clear exposure even through thick photoresists—ranging from tens to hundreds of microns—without pattern distortion.

Handling Wafer Warpage and Topographical Variations: Wafers used in advanced packaging often exhibit significant warpage and surface height variations. The system features enhanced wafer leveling and alignment capabilities, enabling high-precision overlay on non-planar surfaces to ensure high packaging yields.

High Throughput and Automated Integration: The system comes standard with a fully automated 300mm wafer handling system (FOUP), supporting high throughput. It supports SECS/GEM communication protocols, allowing for seamless integration into 300mm automated packaging production lines. Furthermore, the mature ecosystem of the XT platform ensures lower maintenance costs.

Summary

With its unique advantages in exposing thick photoresists using an i-line light source, its precise handling of warped wafers, and its high-throughput performance, the ASML XT:1400Ei serves as an indispensable core lithography tool for 300mm advanced packaging and mature-node manufacturing lines.