Used TOWA CPM1080

The TOWA CPM1080 is a compression molding system developed by the Japanese company TOWA. Specifically designed for wafer-level and panel-level packaging (WLP/PLP), it has served as a benchmark in the field since its launch in 2013.

Core Positioning and Specifications

The system is primarily designed for resin molding processes involving 12-inch (Φ300mm) FOWLP/FIWLP and 320mm × 320mm FOPLP/FIPLP. A key advantage is its dual compatibility with both granular and liquid resins—an industry-first feature that helps reduce material costs and enhances process flexibility.

Key Process Characteristics

The CPM1080 utilizes TOWA’s proprietary compression molding method, which minimizes resin flow. This effectively reduces die shift and void formation, making it highly suitable for advanced packaging applications such as memory devices and 5G-related products. The system is equipped with an in-house-developed handling robot capable of reliably managing heavy substrates or those prone to significant warpage. Regarding consumables, it employs a patented pre-cut release film system; compared to previous TOWA models, this reduces release film consumption by approximately 25% per molding cycle and achieves zero waste.

Configuration Options

The CPM1080 is available in fully automatic, semi-automatic, and manual configurations. The fully automatic version is designed for large-scale mass production, with capacity that can be flexibly adjusted by adding or removing modules. The semi-automatic version is suited for operations requiring manual loading and unloading by an operator, while featuring automated resin supply. The manual version is specifically tailored for high-mix, low-volume production or prototype development.