Used HANMI TC die BONDER 4.0 TIGER

The HANMI TC Bonder 4.0 TIGER is a thermal compression (TC) bonder developed by HANMI Semiconductor specifically for the mass production of HBM4 (sixth-generation High Bandwidth Memory). As part of the company’s 4.0-generation TC Bonder product line, its primary function is to stack DRAM chips layer by layer using thermal compression—a critical process in the packaging of AI semiconductors.

Positioning and Generational Context

Launched in May 2025, this model was engineered by HANMI to meet the production requirements of HBM4. According to the company, it offers significant improvements in both productivity and precision compared to competing products. Within HANMI’s product portfolio, the 4.0 TIGER sits alongside the more advanced 4.5 GRIFFIN; the latter is an upgraded version of the 4.0, presumably optimized for specific customer requirements.

Technical Background and Market Validation

HANMI holds the largest global market share for TC bonders used in HBM production. Following the release of the TC Bonder 4.0 series, the upgraded 4.5 GRIFFIN model secured volume orders from SK Hynix for its HBM4 production lines, with units delivered to the M15X plant in Cheongju. This indicates that the technical foundation of the 4.0 series has been validated by a major industry leader, and the TIGER model—belonging to the same generation—shares this underlying technology platform. Furthermore, HANMI has stated that its TC bonders are also being used in the production of NVIDIA’s next-generation AI chips.

Summary

The HANMI TC Bonder 4.0 TIGER is a 4.0-generation thermal compression bonder designed for HBM4 stacking processes. Positioned between earlier-generation models and the more advanced 4.5 GRIFFIN, it serves the needs of high-volume AI memory production.