HANMI FC Bonder 75 2.5D Large-Format Flip Chip Die Bonder

The HANMI FC Bonder 75 is a large-format flip-chip bonder designed for 2.5D packaging of AI system semiconductors. With its first unit shipped in September 2026, it marks a strategic expansion for HANMI Semiconductor—moving beyond its established position in TC bonders for HBM (High Bandwidth Memory) into the broader realm of system semiconductor packaging equipment.

Core Specification: 75mm-Class Large-Format Interposer

The system supports interposer packaging up to 75mm × 75mm—significantly larger than the ~20mm × 20mm dimensions typical of conventional, general-purpose packaging. This capability directly addresses the requirements of next-generation AI chips, which demand support for ultra-large dies and heterogeneous multi-chip integration, enabling high-density interconnections between components such as GPUs and HBM within a single package.

Process Application: Flip-Chip Bonding

As a flip-chip bonder, the machine facilitates direct connections between conductive bumps on the chip surface and an interposer. This creates short electrical paths and high-density interconnections—a critical process step in 2.5D advanced packaging. Unlike HANMI’s TC bonders, which specialize in the vertical stacking of HBM, the FC Bonder 75 is designed for the process of placing components—such as GPUs and HBM—side-by-side on the same interposer.