Used TEL Thin Flim Deposition Equipment ALPHA-8SE™ i

The TEL ALPHA-8SE™ i is a batch-type thermal processing and thin-film deposition system from Tokyo Electron (TEL), designed for wafers 200mm in diameter or smaller. It is officially categorized for hard mask and gate oxide formation processes. Rather than being intended for advanced logic processes using single-wafer tools, it is primarily designed for production lines manufacturing silicon-based and silicon carbide (SiC) power devices.

Process Capabilities: As a vertical batch furnace system, it can process up to 150 wafers per batch. It supports a wide range of applications, including oxidation, annealing, LPCVD (for polysilicon, silicon nitride, and silicon dioxide), and high-k ALD. In the context of power device manufacturing, it is used for critical steps such as hard mask deposition and the formation of gate insulating layers.

Design Focus: The evolution of the ALPHA-8SE™ i has centered on enhancing operational stability and ease of use, ensuring high equipment uptime while meeting global safety standards. Based on configurations found in the secondary (used) equipment market, the system supports processes ranging from atmospheric pressure to low pressure, features multi-zone temperature control (up to approximately 1025°C), and is compatible with multiple wafer sizes (100mm, 150mm, and 200mm).

In short, this is a high-volume, batch-type thermal deposition platform tailored for mature process nodes and the power semiconductor sector. It occupies a different market segment—in terms of both throughput architecture and application focus—than the single-wafer ALD/PEALD systems from ASM that you have previously looked into.