Used HANMI FC BONDER 3.0 Flip Chip Bonder

The HANMI FC Bonder 3.0, launched by HANMI Semiconductor in 2017, is a third-generation flip-chip bonder—a specialized type of die bonder designed to attach flip-chips directly onto substrates via the bumps located on the chip's surface.

Core Upgrades: Three Years of Performance Enhancement

Developed over a three-year period, this system offers significant improvements in production efficiency and placement accuracy compared to its predecessor. According to the president of HANMI, the machine’s capability to handle "thin and small" dies has been a primary focus—a critical advancement given the increasing trend toward thinner, smaller bare dies in advanced packaging.

Key Improvements: Eight Major Functional Upgrades

The company has announced eight major functional enhancements. Two of these are particularly vital to production efficiency and yield: the integration of a self-diagnosis system to improve operational ease, and an upgraded vision inspection system to ensure the high-precision alignment required for flip-chip bonding.

Market Positioning

This model was first unveiled at SEMICON TAIWAN in 2017, alongside HANMI’s "New Vision Placement 6.0." It is specifically targeted at the high-end semiconductor manufacturing sector in Taiwan.