Used ASAHI COSMO-T Series Transfer Molding Machine

The COSMO-T series from ASAHI Engineering is a standard line of transfer molding equipment designed for semiconductor packaging. Since its introduction in 1999, it has been positioned to meet the needs of both small-batch R&D and high-volume production. The series’ core strengths lie in its broad compatibility and flexible configuration, enabling it to handle a diverse range of products—from conventional lead frames to large-format matrix frames.

Core Specifications and Performance

The COSMO-T series offers clamping force options ranging from 80 to 240 tons and supports configurations with 1 to 4 molding units, accommodating up to 8 lead frames or system strips. It supports frame sizes up to 100×300 mm and provides a maximum injection pressure of 5.0 tons, making it well-suited for packaging requirements such as DIP, QFN, QFP, SOP, and power modules.

Key Process Features

The series incorporates specialized designs for demanding packaging applications. For automotive and industrial-grade power semiconductors, the equipment can be equipped with vacuum molding and retractable ejector pins to effectively control resin bleed on heat sinks. Regarding pressure control, a hydraulic plunger absorbs fluctuations in resin volume to maintain consistent molding pressure, while a spring-loaded plunger paired with a load sensor enables more precise pressure management. Additionally, users can opt for an integrated post-molding image inspection system to automatically detect issues such as resin bleed, chip defects, or surface contamination.

Application Scenarios

The COSMO-T series encompasses both fully automated systems for high-volume production and manual systems tailored for development and evaluation phases, facilitating process parameter tuning and validation by engineers.