Used ASML XT 1250B

The ASML XT:1250B is a fully automated step-and-scan lithography system (scanner) designed for 300mm (12-inch) wafers. Part of ASML’s classic XT platform, it utilizes a KrF (248nm) excimer laser light source.

Core Positioning: A Workhorse for Mature Nodes and Advanced Packaging

This system is primarily used for mature-node semiconductor manufacturing (ranging from 0.25μm to 0.11μm), as well as demanding advanced packaging applications (such as Flip-Chip and Fan-Out) and MEMS fabrication. Leveraging the deep depth of focus and excellent resolution of its KrF light source, the system ensures high-precision pattern transfer even on complex topographies—such as thick photoresist layers or warped wafers.

Key Technical Features

High-Precision Alignment and Overlay: Equipped with ASML’s mature alignment system, the unit is optimized for thick-resist processes and large-wafer warpage. It delivers superior layer-to-layer overlay accuracy, meeting the stringent requirements of advanced packaging.

High Throughput and Automation: The system comes standard with a fully automated 300mm wafer handling system (FOUP) and offers high throughput (wafers per hour, or WPH). It supports SECS/GEM communication, allowing for seamless integration into automated 300mm production lines.

Proven Platform and Low Cost of Ownership: The XT platform boasts a large installed base across the industry, supported by a mature process ecosystem. The system combines high stability with relatively low maintenance costs, making it a highly cost-effective choice for mature-node and advanced packaging production lines.

Summary

With its stable KrF exposure precision, high throughput, and strong compatibility with thick-resist processes, the XT:1250B stands out as a highly competitive core lithography tool for 300mm mature-node manufacturing and advanced packaging applications.