HANMI FC Bonder 3.5 Flip-Chip Bonder for sale

The HANMI FC Bonder 3.5 is a high-end flip-chip bonder introduced by HANMI Semiconductor in June 2026, designed for 2.5D packaging of AI system semiconductors. This launch marks a strategic expansion for the company, moving beyond its established position in TC bonders for HBM (High Bandwidth Memory) into the broader field of system semiconductor packaging equipment.

Core Positioning and Process Capabilities

Specifically engineered for 2.5D logic chip packaging, the system supports Chip-to-Wafer (C2W) bonding and can accommodate large-format panels and substrates up to 340mm. This capability directly addresses the industry trend toward Panel-Level Packaging (PLP) and multi-chip (chiplet) architectures for AI processors. In addition to flip-chip bonding, the equipment supports "face-up" (non-flip-chip) bonding using Die Attach Film (DAF), offering customers greater process flexibility.

Market Significance

Following the release of the FC Bonder 75 in 2025, the FC Bonder 3.5 represents another key move by HANMI Semiconductor into the system semiconductor packaging sector. The equipment targets global wafer foundries and OSAT (Outsourced Semiconductor Assembly and Test) providers, serving major AI chip developers—such as NVIDIA, AMD, and Broadcom—that utilize 2.5D packaging technologies. According to HANMI, the system leverages the company’s proven bonding expertise—honed through its HBM TC bonder technology—with the goal of extending its competitive edge from memory packaging into the back-end processing of system semiconductors.