Used TEL TELFORMULA™

TELFORMULA™ is a vertical batch CVD/ALD deposition platform from Tokyo Electron (TEL) designed for wafers 200mm in diameter and smaller. It serves as a high-volume production furnace system tailored for mature-node semiconductor manufacturing and power semiconductor production.

Process Positioning: Operating in a batch mode, the TELFORMULA system can process anywhere from dozens to hundreds of wafers in a single tube. It supports deposition techniques such as LPCVD and ALD, enabling the formation of thin films including polysilicon, silicon nitride, and silicon oxide. Typical applications include gate polysilicon, sidewall spacers, hard masks, and passivation layers. Its batch architecture delivers high throughput and low cost-per-wafer, making it well-suited for production lines at mature nodes where high throughput is a priority and the precision requirements for individual wafers are relatively more relaxed.

Design Focus: The platform prioritizes process stability and high equipment uptime (tool availability). It features multi-zone temperature control and low-pressure processing capabilities, while supporting various wafer sizes to allow for flexible production line transitions. While it belongs to the same family of batch deposition systems as TEL’s Episode series, the TELFORMULA platform features distinct process configurations and precursor delivery systems, enabling it to address a broader range of thin-film requirements for mature-node technologies.

In short, TELFORMULA is a batch-type CVD/ALD production platform from TEL, positioned for mature-node and power semiconductor applications—distinct from the single-wafer processing equipment for advanced-node technologies that you have previously looked into.