Used Besi AMS-X for sale

The Besi AMS-X is an automated lead-frame molding system designed for high-density and power semiconductor packaging. It aims to redefine standards for lead-frame encapsulation, with a particular focus on the automotive electronics market.

Key Specifications

The system features a maximum clamping force of 180 tons and accommodates lead frames up to 125 × 300 mm with a thickness of up to 10 mm; the maximum mold opening is 150 mm. It delivers a throughput of up to 240 lead frames per hour—an output that is up to 30% higher than that of comparable systems.

Key Technical Features

The AMS-X utilizes a newly developed, compact platen-style press. Each press is equipped with four independently controlled clamping modules, ensuring uniform pressure distribution across the product and enabling flash-free molding. A unique runner design reduces molding compound consumption by approximately 15%, helping to control operational costs. The system supports recipe-controlled deep-vacuum levels and offers an optional 100% visual inspection for both input and output, facilitating a zero-defect objective.

Target Applications

This system is primarily designed for applications requiring high packaging quality and reliability—such as IGBTs, power devices, MEMS, and QFN/QFP packages—and is especially well-suited to the stringent requirements of the automotive semiconductor sector, where flash-free molding and high consistency are essential.