Used ASML XT:1250i for sale

The ASML XT:1250i is a fully automated step-and-scan lithography system (scanner) designed for 300mm (12-inch) wafers. Part of ASML’s classic XT platform, it utilizes an i-line (365nm) light source.

Core Positioning: A Workhorse for Advanced Packaging and Thick-Resist Processes

This system primarily serves mature process nodes (0.35μm and above), but it excels particularly in advanced packaging—such as Flip-Chip, Fan-Out, and 2.5D/3D integration—as well as in MEMS manufacturing. The i-line light source offers excellent penetration depth in thick photoresists, making the system a critical tool for patterning steps in packaging production lines.

Key Technical Features

Large Exposure Field and High Depth of Focus: Equipped with an i-line lens that provides a deep depth of focus, the system is ideally suited for thick-resist processes (e.g., creating bumps tens of microns high or forming redistribution layers). Its step-and-scan architecture ensures high pattern fidelity across the entire exposure field.

Superior Handling of Warped Wafers: To address wafer warpage and surface topography variations—common challenges in advanced packaging—the system features optimized leveling and alignment subsystems, ensuring high-precision overlay accuracy even on non-planar surfaces.

High Throughput and Automation: The system comes standard with a fully automated 300mm wafer handling system (FOUP) and delivers high throughput. It supports SECS/GEM communication, allowing for seamless integration into automated high-volume production lines. The XT platform is mature, stable, and offers a lower cost of ownership.

Summary

With its unique advantages in thick-resist processing (leveraging an i-line light source), exceptional capability in handling warped wafers, and high throughput, the XT:1250i serves as an indispensable core lithography tool for 300mm advanced packaging and mature-node semiconductor manufacturing.