Used ASML XT:400G Fully Automated Step-and-Scan Lithography System for sale

The ASML XT:400G is a fully automated step-and-scan lithography system (scanner) designed for 300mm (12-inch) wafers. Part of ASML’s classic XT platform, it utilizes an i-line (365nm) light source.

Core Positioning: A Mainstay for Mature Process Nodes and Advanced Packaging

Unlike earlier "steppers," the XT:400G employs "step-and-scan" technology, which enables higher pattern fidelity across a larger exposure field. It primarily serves mature process nodes (e.g., 0.35μm and above), demanding advanced packaging applications (such as Flip-Chip, Fan-Out, and 2.5D/3D integration), as well as MEMS manufacturing.

Key Technical Features

High-Precision Alignment and Overlay: Equipped with ASML’s proven alignment system, the tool is optimized for processes involving thick photoresist and wafers with significant warpage—common in advanced packaging—ensuring high-precision layer-to-layer overlay.

High Productivity and Automation: It comes standard with a fully automated 300mm wafer handling system (FOUP) and delivers high throughput (wafers per hour, or WPH). Supporting the SECS/GEM communication standard, it integrates seamlessly into automated 300mm high-volume production lines.

Process Compatibility and Low Cost of Ownership: The XT platform boasts a massive global installed base and a mature process ecosystem. The system combines high stability with low maintenance costs, making it a highly cost-effective choice for mature process nodes and packaging production lines.

Summary

The XT:400G is a mature, high-volume production lithography system from ASML for the 300mm i-line segment. Renowned for its stable exposure precision, high throughput, and excellent process compatibility, it serves as an indispensable core lithography tool for both mature process nodes and advanced packaging production lines.